PRODUCT
제품소개Managed NAND
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AS100 시리즈
PCIe Gen4 x4 / NVMe 1.4
291-ball BGA. M.2 1620.
176-layer 3D TLC NAND
128GB to 1TB
Op. temp 0℃ to 70℃
DRAM-less with HMB
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AS300 시리즈
PCIe Gen4 x4 / NVMe 1.4
291-ball BGA. M.2 1620.
176-layer 3D TLC NAND
128GB to 1TB
Op. temp -40℃ to 85℃
DRAM-less with HMB
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AS500 시리즈
PCIe Gen4 x4 / NVMe 1.4
291-ball BGA. M.2 1620.
176-layer 3D TLC NAND
128GB to 1TB
Op. temp -40℃ to 105℃
DRAM-less with HMB
Built-in SR-IOV
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EM100 시리즈
e.MMC v5.1. 153-ball FBGA.
TLC / MLC NAND
MLC: 4GB / 8GB
TLC: 16GB to 128GB
Up to 295 MB/s sequential performance
Op. temp -25℃ to 85℃
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EM300 시리즈
e.MMC v5.1. 153-ball FBGA.
TLC / MLC NAND
MLC: 4GB / 8GB
TLC: 16GB to 128GB
Up to 295 MB/s sequential performance
Op. temp -40℃ to 85℃
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EM500 시리즈
e.MMC v5.1. 153-ball FBGA.
176-layer 3D TLC NAND
pSLC: 4GB / 8GB / 16GB
TLC: 32GB to 256GB
Up to 295 MB/s sequential performance
Op. temp -40℃ to 105℃
Firmware customizable.
